re: PC Discussion - Gaming, Performance and Enthusiasts

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A new technology introduced by Taiwan Semiconductor Manufacturing Company (TSMC) could boost the power of graphics cards by Nvidia and AMD without making them physically larger. The technology is called wafer-on-wafer, and mimics 3D NAND memory technology used in modern solid-state drives by stacking layers vertically rather than spreading the hardware horizontally across the printed circuit board, which would require additional physical space.

Right now, graphics chips produced by Nvidia and AMD rely on a single wafer. But TSMC, the largest dedicated independent semiconductor foundry on the planet, discovered a way to stack two wafers in a single package. The upper wafer is flipped over onto the lower wafer, and then both are bonded together. Moreover, the upper wafer contains the in/out connection piercings (aka thru-silicon vias), thus the duo is packaged using flip-chip technology.

According to TSMC partner Cadence, the technology could see two sets of wafers connecting to each other in a cube-shaped package using what’s called an interposer, an electrical interface that routes one connection to another. More than two wafers could be stacked vertically as well, with all but one wafer sporting the in/out thru-silicon vias connections.

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It's a cooler master masterwatt 550watt bronze. Never used a cooler master PSU after using Corsair and Seasonic in the past. Figured I'd give it a shot since my system only has a ryzen 2400g and no GPU.

My mistake.

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