- My Forums
- Tiger Rant
- LSU Recruiting
- SEC Rant
- Saints Talk
- Pelicans Talk
- More Sports Board
- Fantasy Sports
- Golf Board
- Soccer Board
- O-T Lounge
- Tech Board
- Home/Garden Board
- Outdoor Board
- Health/Fitness Board
- Movie/TV Board
- Book Board
- Music Board
- Political Talk
- Money Talk
- Fark Board
- Gaming Board
- Travel Board
- Food/Drink Board
- Ticket Exchange
- TD Help Board
Customize My Forums- View All Forums
- Show Left Links
- Topic Sort Options
- Trending Topics
- Recent Topics
- Active Topics
Started By
Message
ADEA - Adeia Inc. Intellectual Property Company
Posted on 6/3/26 at 8:16 pm
Posted on 6/3/26 at 8:16 pm
I’m getting tingly again.
I did not discover this company on my own. I heard stock talk mention it yesterday in relation to what he thinks is the next phase of silicon packaging technology—Hybrid Bonding.
I could tell that he’s really excited about it. In fact, he’s writing a dissertation on the subject as we speak.
I’ll be posting that as soon as I see it.
So, ADEA…
This is an IP and R&D company that spun out of Xperi in 2022.
They acquire patents and they develop them in house, having recently made a brilliant move to tackle the ever advancing semiconductor market.
The legacy business is old pay tv media stuff, but they also own a lot of OTT licenses as well (streaming) that brings in decent income. If that’s all they did this would be a $15 stock and no one would be talking about it. Few are even now (under 600 watchers on StockTwits).
Before I move on, I will say that they successfully litigated a small company named Disney who attempted to refuse paying for ADEA OTT IP. Feel free to look into that on your own.
But the future is all about hybrid bonding. ADEA has developed in house patents for the hybrid bonding of chips and something called RapidCool.
On RapidCool (not yet a revenue stream!!):
Adeia developed RapidCool in-house as a proprietary, direct-to-chip liquid cooling technology. Their internal research and development team engineered this architecture to eliminate traditional thermal interface materials, allowing liquid cooling to interface more directly with high-density chips.
Because Adeia's own engineers created and patented this technology, the company owns the foundational intellectual property outright.
In early 2026, Adeia's internal team received the Excellence in Innovation Award from Global Brands Magazine, recognizing this breakthrough for solving critical thermal management challenges in artificial intelligence infrastructure.
Now, hybrid bonding itself…
As concisely as I can put it, High Performance Computing (AI) needs faster, more energy efficient silicon.
Why?
To handle massive AI and data workloads without hitting the "thermal wall" or exhausting power grids.
- Traditional packaging creates bottlenecks in data transfer speed and wastes power as heat.
- Hybrid bonding eliminates these limitations by stacking chips vertically with ultra-short, direct copper interconnects.
- This drastically reduces data latency, multiplies bandwidth, and improves energy efficiency at sub-micron scales (microscopic structures that cannot be seen with a standard optical microscope. For instance, the copper interconnects used in hybrid bonding or the channels designed for direct-to-chip liquid cooling must be aligned at sub-micron tolerances).
What evidence indicates future adoption of Hybrid Bonding?
ADEA vs. AMD 2026
In short, Adeia sued AMD because its high-performance processors, featuring 3D V-Cache, relied extensively on Adeia's hybrid bonding patents to fuse copper and dielectric layers directly between dies.
Rather than re-architecting its chip-stack designs or abandoning the performance benefits, AMD chose to enter into a comprehensive, multi-year IP licensing agreement with Adeia.
This commercial settlement proves that industry leaders view hybrid bonding as an irreplaceable, foundational architecture for next-generation vertical chip integration.
The lawsuit only lasted 4 months, and the stock jumped 26% that day…
Reiterating AMD plus two more revenue streams:
Advanced Micro Devices (AMD)
AMD recently signed a multi-year patent licensing agreement for Adeia's comprehensive semiconductor portfolio. This arrangement formally resolved pre-existing patent litigation and secured an outright intellectual property engine allowing AMD to deploy 3D chip packaging configurations (such as V-Cache) across future graphics and high-performance computer chip architectures.
United Microelectronics Corporation (UMC)
UMC expanded and renewed its intellectual property licensing relationship with Adeia. The new disclosure extends continued foundry process privileges to Adeia’s entire backlog of 3D integration patents, permitting the stacking and manufacturing of radio-frequency silicon-on-insulator (RFSOI) wafers geared toward wireless architectures and advanced chiplet production.
Kioxia Corporation
Kioxia entered into a long-term semiconductor patent license for Adeia’s advanced stacking mechanics. As a major producer of flash memory, Kioxia leverages this hybrid bonding metrology to stack storage layers much tighter, minimizing latency in its deployments of next-generation three-dimensional NAND chips.
And guess what Intel posted today?
A job posting for a hybrid bonding engineer.
Right around the time that posting started getting noticed the stock really popped on a bad market day…
Make of it what you will.
I’ll need to add financial metrics later, but it is clearly in the process of being re rated for semiconductor technology.
End of year PT: $65
2028 Bull Case: $140
I had 450 shares, but ended up buying 11 November calls.
Still own 214 after a small after hours purchase today.
Look at the options volume today on September $35s
I literally couldn’t catch them.
It may have been stock talk piling in for more.
I did not discover this company on my own. I heard stock talk mention it yesterday in relation to what he thinks is the next phase of silicon packaging technology—Hybrid Bonding.
I could tell that he’s really excited about it. In fact, he’s writing a dissertation on the subject as we speak.
I’ll be posting that as soon as I see it.
So, ADEA…
This is an IP and R&D company that spun out of Xperi in 2022.
They acquire patents and they develop them in house, having recently made a brilliant move to tackle the ever advancing semiconductor market.
The legacy business is old pay tv media stuff, but they also own a lot of OTT licenses as well (streaming) that brings in decent income. If that’s all they did this would be a $15 stock and no one would be talking about it. Few are even now (under 600 watchers on StockTwits).
Before I move on, I will say that they successfully litigated a small company named Disney who attempted to refuse paying for ADEA OTT IP. Feel free to look into that on your own.
But the future is all about hybrid bonding. ADEA has developed in house patents for the hybrid bonding of chips and something called RapidCool.
On RapidCool (not yet a revenue stream!!):
Adeia developed RapidCool in-house as a proprietary, direct-to-chip liquid cooling technology. Their internal research and development team engineered this architecture to eliminate traditional thermal interface materials, allowing liquid cooling to interface more directly with high-density chips.
Because Adeia's own engineers created and patented this technology, the company owns the foundational intellectual property outright.
In early 2026, Adeia's internal team received the Excellence in Innovation Award from Global Brands Magazine, recognizing this breakthrough for solving critical thermal management challenges in artificial intelligence infrastructure.
Now, hybrid bonding itself…
As concisely as I can put it, High Performance Computing (AI) needs faster, more energy efficient silicon.
Why?
To handle massive AI and data workloads without hitting the "thermal wall" or exhausting power grids.
- Traditional packaging creates bottlenecks in data transfer speed and wastes power as heat.
- Hybrid bonding eliminates these limitations by stacking chips vertically with ultra-short, direct copper interconnects.
- This drastically reduces data latency, multiplies bandwidth, and improves energy efficiency at sub-micron scales (microscopic structures that cannot be seen with a standard optical microscope. For instance, the copper interconnects used in hybrid bonding or the channels designed for direct-to-chip liquid cooling must be aligned at sub-micron tolerances).
What evidence indicates future adoption of Hybrid Bonding?
ADEA vs. AMD 2026
In short, Adeia sued AMD because its high-performance processors, featuring 3D V-Cache, relied extensively on Adeia's hybrid bonding patents to fuse copper and dielectric layers directly between dies.
Rather than re-architecting its chip-stack designs or abandoning the performance benefits, AMD chose to enter into a comprehensive, multi-year IP licensing agreement with Adeia.
This commercial settlement proves that industry leaders view hybrid bonding as an irreplaceable, foundational architecture for next-generation vertical chip integration.
The lawsuit only lasted 4 months, and the stock jumped 26% that day…
Reiterating AMD plus two more revenue streams:
Advanced Micro Devices (AMD)
AMD recently signed a multi-year patent licensing agreement for Adeia's comprehensive semiconductor portfolio. This arrangement formally resolved pre-existing patent litigation and secured an outright intellectual property engine allowing AMD to deploy 3D chip packaging configurations (such as V-Cache) across future graphics and high-performance computer chip architectures.
United Microelectronics Corporation (UMC)
UMC expanded and renewed its intellectual property licensing relationship with Adeia. The new disclosure extends continued foundry process privileges to Adeia’s entire backlog of 3D integration patents, permitting the stacking and manufacturing of radio-frequency silicon-on-insulator (RFSOI) wafers geared toward wireless architectures and advanced chiplet production.
Kioxia Corporation
Kioxia entered into a long-term semiconductor patent license for Adeia’s advanced stacking mechanics. As a major producer of flash memory, Kioxia leverages this hybrid bonding metrology to stack storage layers much tighter, minimizing latency in its deployments of next-generation three-dimensional NAND chips.
And guess what Intel posted today?
A job posting for a hybrid bonding engineer.
Right around the time that posting started getting noticed the stock really popped on a bad market day…
Make of it what you will.
I’ll need to add financial metrics later, but it is clearly in the process of being re rated for semiconductor technology.
End of year PT: $65
2028 Bull Case: $140
I had 450 shares, but ended up buying 11 November calls.
Still own 214 after a small after hours purchase today.
Look at the options volume today on September $35s
I literally couldn’t catch them.
It may have been stock talk piling in for more.
6
Posted on 6/3/26 at 8:17 pm to bayoubengals88
TLDR VERSION
I. The Company and Legacy
Adea is an intellectual property and research and development company that spun out of Xperi in 2022. While supported by a steady legacy business in media and streaming licenses—reinforced by a successful lawsuit against Disney—the market is actively re-rating Adea as a high-growth semiconductor play.
II. Commercial Validation and Future Growth
The company's future relies on patented, in-house tech: hybrid bonding and direct-to-chip liquid cooling. These breakthroughs are vital for artificial intelligence chips, vertical stacking, and heat reduction. Industry leaders validate Adea's portfolio through major revenue agreements:
* Advanced Micro Devices signed a multi-year deal following a rapid patent dispute settlement.
* United Microelectronics Corporation expanded licenses for advanced manufacturing.
* Kioxia uses the tech for high-density flash memory.
My end-of-year price target is $65 and my 2028 bull case is $140.
I. The Company and Legacy
Adea is an intellectual property and research and development company that spun out of Xperi in 2022. While supported by a steady legacy business in media and streaming licenses—reinforced by a successful lawsuit against Disney—the market is actively re-rating Adea as a high-growth semiconductor play.
II. Commercial Validation and Future Growth
The company's future relies on patented, in-house tech: hybrid bonding and direct-to-chip liquid cooling. These breakthroughs are vital for artificial intelligence chips, vertical stacking, and heat reduction. Industry leaders validate Adea's portfolio through major revenue agreements:
* Advanced Micro Devices signed a multi-year deal following a rapid patent dispute settlement.
* United Microelectronics Corporation expanded licenses for advanced manufacturing.
* Kioxia uses the tech for high-density flash memory.
My end-of-year price target is $65 and my 2028 bull case is $140.
This post was edited on 6/3/26 at 8:19 pm
Posted on 6/3/26 at 8:17 pm to bayoubengals88
Financial metrics
Posted on 6/3/26 at 8:17 pm to bayoubengals88
Loading Twitter/X Embed...
If tweet fails to load, click here.This post was edited on 6/3/26 at 8:20 pm
Posted on 6/3/26 at 8:24 pm to bayoubengals88
The thesis is simple.
I believe that revenues and eps will compound in this high margin business.
Conviction levels:
NBIS 9.5/10
OUST 8.5/10
ADEA 7.5/10
I really liked their recent conference call, but the ceo is stepping down this year, otherwise, conviction may be higher.
I believe that revenues and eps will compound in this high margin business.
Conviction levels:
NBIS 9.5/10
OUST 8.5/10
ADEA 7.5/10
I really liked their recent conference call, but the ceo is stepping down this year, otherwise, conviction may be higher.
Posted on 6/3/26 at 8:36 pm to bayoubengals88
Truly a textbook momentum entry after a retest of the 9 EMA
Posted on 6/3/26 at 9:04 pm to bayoubengals88
BESI seems to be the most pure play hybrid- bonding play
Posted on 6/3/26 at 9:23 pm to bayoubengals88
I’ll sell something tomorrow to buy some ADEA
Posted on 6/3/26 at 10:21 pm to bayoubengals88
quote:
Adeia is a prominent patent assertion entity (often labeled as a "patent troll"). The company does not manufacture or sell products itself; instead, it generates revenue by acquiring intellectual property—primarily in the semiconductor, media, and technology sectors—and aggressively licensing it or suing hardware manufacturers.
quote:
The company's future relies on patented, in-house tech:
Nope.
I like alot of your recs, but i'm out on this one. Scumbag company.
This post was edited on 6/3/26 at 10:27 pm
Posted on 6/4/26 at 6:08 am to bayoubengals88
ST notes from 5/11:
[quote]ADEIA $ADEA VALUABLE SEMICONDUCTOR IP While Adea's main business is media IP, they have significant optionality in their semiconductor IP business, including hybrid bonding, advanced packaging, wafer-to-wafer and die-to-wafer technologies, advanced process-node technologies, microLED-related IP, and thermal-management technologies such as RapidCool. Their customers include Micron $MU, Sandisk $SNDK, SK Hynix, AMD, Samsung, Sony, UMC, and STM STMicroelectronics. Adeia’s semiconductor IP is valuable primarily because it sits at the intersection of advanced packaging, hybrid bonding, 3D integration, HBM, 3D NAND, chiplets, RF integration, image sensors, and AI compute thermals. This is not “chip design IP” like Arm CPU cores or Synopsys EDA/software IP. It is closer to process, packaging, interconnect & manufacturing-enablement IP. The highest-value part of the portfolio is hybrid bonding / DBI / DBI Ultra, not the broader generic “semiconductor" portfolio. That is where Adeia has the clearest evidence of blue-chip customer adoption. The industry problem is clear: Moore’s Law scaling is no longer enough. Chip performance is increasingly constrained by memory bandwidth, package interconnect density, thermal limits, power efficiency, and yield. Advanced packaging is becoming a primary scaling vector. Hybrid bonding directly addresses this. It gives semiconductor manufacturers a way to stack logic, memory, sensors, and RF devices with much denser electrical connections than traditional microbumps. Adeia says hybrid bonding is rapidly being designed into logic and memory products that support the AI ecosystem. SK HYNIX: In 2020, Xperi/Adeia announced a new patent and technology license agreement with SK hynix, including access to its broad semiconductor IP portfolio and a technology transfer of Invensas DBI Ultra 3D interconnect technology focused on next-generation memory. MICRON: In 2022, Xperi/Adeia announced a multi-year agreement with Micron under which Micron gained access to Adeia’s hybrid bonding IP to enhance next-generation memory devices. SANDISK/WESTERN DIGITAL: Adeia separately announced in 2023 that Western Digital entered into a long-term agreement to license Adeia’s semiconductor patent portfolio, including patents relating to hybrid bonding. Western Digital completed the separation of its Flash business in February 2025, and SanDisk became an independent public company under ticker SNDK. Adeia’s 2025 10-K then lists SanDisk among its semiconductor customers. SAMSUNG: Xperi announced in 2018 that it settled litigation with Samsung Electronics and entered into a new patent license agreement. AMD: Adeia’s lawsuits alleged AMD processors with 3D V-Cache infringed patents concerning hybrid bonding and advanced process nodes; AMD denied the allegations, and the case settled with AMD taking a multi-year license in March 2026. Adeia’s Q1 2026 release later specified that AMD licensed the semiconductor portfolio including hybrid bonding technology. INTERNAL INNOVATION ENGINE Adeia has approximately 13,750 patents and applications, including about 6,250 U.S. issued patents, 1,950 U.S. applications, 4,100 foreign issued patents & 1,450 foreign applications. Adeia says approximately 80% of its combined patent portfolio came from internal innovation. That is important. A pure patent aggregator can be more vulnerable to accusations that it merely buys and litigates. Adeia has a stronger argument that it is a long-term R&D organization that creates valuable technology. The company runs beautiful profitability metrics with 87% gross margins, 47% operating margins, and 27% net margins trading at 12x EV/EBITDA and 20x FCF.
[quote]ADEIA $ADEA VALUABLE SEMICONDUCTOR IP While Adea's main business is media IP, they have significant optionality in their semiconductor IP business, including hybrid bonding, advanced packaging, wafer-to-wafer and die-to-wafer technologies, advanced process-node technologies, microLED-related IP, and thermal-management technologies such as RapidCool. Their customers include Micron $MU, Sandisk $SNDK, SK Hynix, AMD, Samsung, Sony, UMC, and STM STMicroelectronics. Adeia’s semiconductor IP is valuable primarily because it sits at the intersection of advanced packaging, hybrid bonding, 3D integration, HBM, 3D NAND, chiplets, RF integration, image sensors, and AI compute thermals. This is not “chip design IP” like Arm CPU cores or Synopsys EDA/software IP. It is closer to process, packaging, interconnect & manufacturing-enablement IP. The highest-value part of the portfolio is hybrid bonding / DBI / DBI Ultra, not the broader generic “semiconductor" portfolio. That is where Adeia has the clearest evidence of blue-chip customer adoption. The industry problem is clear: Moore’s Law scaling is no longer enough. Chip performance is increasingly constrained by memory bandwidth, package interconnect density, thermal limits, power efficiency, and yield. Advanced packaging is becoming a primary scaling vector. Hybrid bonding directly addresses this. It gives semiconductor manufacturers a way to stack logic, memory, sensors, and RF devices with much denser electrical connections than traditional microbumps. Adeia says hybrid bonding is rapidly being designed into logic and memory products that support the AI ecosystem. SK HYNIX: In 2020, Xperi/Adeia announced a new patent and technology license agreement with SK hynix, including access to its broad semiconductor IP portfolio and a technology transfer of Invensas DBI Ultra 3D interconnect technology focused on next-generation memory. MICRON: In 2022, Xperi/Adeia announced a multi-year agreement with Micron under which Micron gained access to Adeia’s hybrid bonding IP to enhance next-generation memory devices. SANDISK/WESTERN DIGITAL: Adeia separately announced in 2023 that Western Digital entered into a long-term agreement to license Adeia’s semiconductor patent portfolio, including patents relating to hybrid bonding. Western Digital completed the separation of its Flash business in February 2025, and SanDisk became an independent public company under ticker SNDK. Adeia’s 2025 10-K then lists SanDisk among its semiconductor customers. SAMSUNG: Xperi announced in 2018 that it settled litigation with Samsung Electronics and entered into a new patent license agreement. AMD: Adeia’s lawsuits alleged AMD processors with 3D V-Cache infringed patents concerning hybrid bonding and advanced process nodes; AMD denied the allegations, and the case settled with AMD taking a multi-year license in March 2026. Adeia’s Q1 2026 release later specified that AMD licensed the semiconductor portfolio including hybrid bonding technology. INTERNAL INNOVATION ENGINE Adeia has approximately 13,750 patents and applications, including about 6,250 U.S. issued patents, 1,950 U.S. applications, 4,100 foreign issued patents & 1,450 foreign applications. Adeia says approximately 80% of its combined patent portfolio came from internal innovation. That is important. A pure patent aggregator can be more vulnerable to accusations that it merely buys and litigates. Adeia has a stronger argument that it is a long-term R&D organization that creates valuable technology. The company runs beautiful profitability metrics with 87% gross margins, 47% operating margins, and 27% net margins trading at 12x EV/EBITDA and 20x FCF.
Posted on 6/4/26 at 6:09 am to itsbigmikey
He also doubled his position on 6/1
Posted on 6/4/26 at 6:09 am to Odinson
quote:
BESI seems to be the most pure play hybrid- bonding play
As far as a pure play, yes.
ADEA is a toll booth play on it.
Also have ONTO in my wife’s account.
Posted on 6/4/26 at 6:11 am to bayoubengals88
Reading back through your post and the discord, it was him on the $35 sept calls hahaha
Posted on 6/4/26 at 6:16 am to j1897
quote:That is one way to look at it.
Scumbag company.
However, the ST notes above directly refute that saying that 80% of IP comes from in house R&D.
Posted on 6/4/26 at 6:17 am to itsbigmikey
quote:I had little doubt.
Reading back through your post and the discord, it was him on the $35 sept calls hahaha
Appreciate the info!!
Posted on 6/4/26 at 6:24 am to itsbigmikey
quote:
Reading back through your post and the discord, it was him on the $35 sept calls hahaha
Based on his options style this is super bullish. He was paying above $6 for a $35 strike just three months out, which is about as close date wise as he plays options.
He would not be buying thousands of these contracts without having good reason to believe that the stock won’t be $45+ in September. Or sooner.
Of course, even he could be wrong. But that’s some aggressive action.
This post was edited on 6/4/26 at 6:33 am
Posted on 6/4/26 at 6:45 am to bayoubengals88
Here’s a bear. You never know their motives…
Loading Twitter/X Embed...
If tweet fails to load, click here.Posted on 6/4/26 at 6:45 am to bayoubengals88
Posted on 6/4/26 at 8:13 am to bayoubengals88
quote:
ST notes above directly refute that saying that 80% of IP comes from in house R&D.
I mean, they got almost all of their patents from Tivo(yes that tivo). So yes, you could state they are in-house patents.
Wallstreetbets is grouping this in with AI stocks, but this is no AI stock.
Posted on 6/4/26 at 9:16 am to j1897
quote:That's the entire thesis and trade. You say it's not, I say it will be.
Wallstreetbets is grouping this in with AI stocks, but this is no AI stock.
Page 1 of 2
Popular
Back to top
Follow TigerDroppings for LSU Football News